As smartphone technology advances, mobile chipset manufacturers continue to push the limits of performance, efficiency, and AI capabilities. Two of the latest contenders in the flagship and upper-midrange segments are Qualcomm’s Snapdragon 8 Gen 3 and MediaTek’s Dimensity 8400 Ultra. These chipsets power high-end and premium mid-range smartphones, offering cutting-edge features and optimizations. In this article, we will compare their specifications, benchmark scores, and key differences to determine which one has the edge.
Specification | Snapdragon 8 Gen 3 | Dimensity 8400 Ultra |
---|---|---|
Manufacturing Process | 4nm (TSMC) | 4nm (TSMC) |
CPU Architecture | 1x Cortex-X4 @ 3.3GHz 5x Cortex-A720 2x Cortex-A520 | 1x Cortex-X4 @ 3.2GHz 4x Cortex-A720 3x Cortex-A520 |
GPU | Adreno 750 | Mali-G720 MC10 |
AI Engine | Hexagon NPU | APU 790 |
RAM Support | LPDDR5X (up to 8533 Mbps) | LPDDR5X (up to 8533 Mbps) |
Storage | UFS 4.0 | UFS 4.0 |
Camera Support | Up to 200MP | Up to 200MP |
Display Support | QHD+ @ 144Hz | QHD+ @ 144Hz |
Connectivity | Snapdragon X75 5G modem | MediaTek 5G modem |
Benchmarks provide an objective way to compare the raw power of chipsets. Here are the latest benchmark results for both processors:
From these benchmarks, it is evident that the Snapdragon 8 Gen 3 has a superior CPU and GPU, making it a better choice for high-performance gaming and intensive workloads.
The Snapdragon 8 Gen 3 uses a more aggressive CPU configuration with one Cortex-X4 core at 3.3GHz and five Cortex-A720 cores, offering better multi-core performance. The Dimensity 8400 Ultra, on the other hand, has a slightly lower clocked Cortex-X4 (3.2GHz) and fewer performance cores, making it slightly less powerful in CPU-intensive tasks.
The Adreno 750 GPU in the Snapdragon 8 Gen 3 outperforms the Mali-G720 MC10 in the Dimensity 8400 Ultra. Qualcomm’s GPU offers better ray tracing support, improved gaming performance, and higher efficiency in rendering graphics.
Both chipsets come with dedicated AI processing units. The Hexagon NPU in the Snapdragon 8 Gen 3 is optimized for AI-driven applications like computational photography, voice assistants, and real-time translation. MediaTek’s APU 790 is also quite powerful, but Qualcomm's solution is generally ahead in AI workloads.
The Snapdragon 8 Gen 3 features the latest Snapdragon X75 5G modem, providing faster data speeds and better network efficiency. The Dimensity 8400 Ultra, while still competitive, lags slightly in 5G connectivity and Wi-Fi 7 performance.
Both chips are built on TSMC’s 4nm process, ensuring excellent power efficiency. However, real-world tests show that the Snapdragon 8 Gen 3 is slightly more efficient, especially in sustained performance scenarios.
For flagship devices, Snapdragon 8 Gen 3 remains the preferred choice, while the Dimensity 8400 Ultra is an excellent option for upper-midrange smartphones.
Both chipsets are powerful, but the Snapdragon 8 Gen 3 takes the lead in CPU, GPU, AI, and connectivity. However, the Dimensity 8400 Ultra provides strong competition at a potentially lower price, making it a compelling option for budget-conscious users.
If performance is your top priority, go for Snapdragon 8 Gen 3. If you want great performance at a lower price, Dimensity 8400 Ultra is a solid alternative.
Disclaimer: This article is based on publicly available data and benchmark reports. Performance may vary depending on device optimizations and real-world usage.
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