Xiaomi is reportedly gearing up for the launch of its second-generation self-developed SoC, the Xring O2, which could arrive between the second and third quarters of 2026. According to industry tipster Fixed Focus Digital, the chip may debut around September next year, continuing Xiaomi’s push toward semiconductor independence.
Xiaomi’s journey into chipmaking began with the Xring O1, the company’s first in-house processor. Despite speculation that it was simply a custom Arm design, Xiaomi clarified that while CPU and GPU IPs were licensed from Arm, the architecture design, memory subsystem, and backend implementation were fully developed in-house over four years.
The Xring O1, built on a 3nm process, debuted in the Xiaomi 15s Pro. It delivered impressive CPU performance, efficient thermal management, and smooth gaming experiences. The chip even outperformed Qualcomm’s Snapdragon 8 Elite in certain Wi-Fi-based benchmarks. However, it had limitations, particularly in battery efficiency due to its reliance on an external 5G modem.
The Xring O2 is expected to bring significant performance upgrades with Arm’s latest CPU architecture, promising at least a 15% IPC (instructions per cycle) improvement thanks to better scalability.
Cortex-X9 Ultra-Large Cores: The O2 may integrate Arm’s Cortex-X9 cores, the same architecture anticipated in upcoming flagship SoCs like MediaTek’s Dimensity 9500.
TSMC 3nm N3E Process: The chip is likely to be manufactured on TSMC’s advanced 3nm N3E node, improving efficiency and power management.
Enhanced GPU, ISP & NPU: Building on lessons from the O1, Xiaomi is expected to refine GPU performance, improve low-light image processing, and unlock greater potential for AI-powered applications.
Potential In-House 5G Modem: Industry reports suggest Xiaomi is also developing its own 5G modem, which could be integrated into the O2 or future generations, reducing reliance on third-party solutions and improving power efficiency.
Tipster Digital Chat Station claims Xiaomi intends to use the Xring O2 beyond smartphones. The chip may also power tablets, wearables, and even smart vehicles, aligning with the company’s growing presence in the EV space. If successful, this would position Xiaomi as not just a smartphone giant, but a holistic tech ecosystem player with semiconductor independence at its core.
Despite progress, Xiaomi faces challenges in accessing cutting-edge fabrication nodes due to ongoing export restrictions. While the O2 is set to use TSMC’s 3nm process, the company may face hurdles in moving to 2nm or beyond. Nevertheless, if timelines remain steady, the Xring O2 is expected to debut alongside Xiaomi’s next-generation flagship smartphones in late 2026, with gradual expansion into the broader Xiaomi ecosystem in the years ahead.
The Xring O2 SoC could mark a major milestone in Xiaomi’s quest for semiconductor independence. With performance upgrades, broader product integration, and potential in-house modem development, the chip reflects Xiaomi’s ambition to compete directly with industry leaders like Qualcomm, Apple, and MediaTek. If delivered as promised, the Xring O2 could redefine Xiaomi’s role in the global tech landscape.
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