In the ever-evolving world of smartphone processors, Qualcomm and MediaTek continue to push boundaries in the premium mid-range segment. With the release of the Snapdragon 8s Gen 3 and the Dimensity 8300 Ultra, both chipmakers aim to strike the perfect balance between flagship performance and affordability. But how do these two powerhouses truly compare? Let’s dive into the details to find out which SoC offers better value, performance, and innovation.
| Feature | Snapdragon 8s Gen 3 | Dimensity 8300 Ultra |
|---|---|---|
| Launch Date | March 18, 2024 | November 2023 |
| Manufacturing Process | TSMC 4nm | TSMC 4nm |
| CPU Configuration | 1x Cortex-X4 + 4x A720 + 3x A520 | 1x Cortex-A715 + 3x A715 + 4x A510 |
| Peak CPU Clock Speed | 3.0GHz (Cortex-X4) | 3.35GHz (Cortex-A715) |
| GPU | Adreno 735 | Mali-G615 MC6 |
| AI Engine | Hexagon NPU with on-device LLM support | APU 780 supports 10B parameter models |
| Camera Support | Up to 200MP, 4K HDR video | Up to 320MP, 4K @ 60fps HDR |
| 5G Modem | Snapdragon X70 (mmWave + Sub-6GHz) | Integrated Sub-6GHz 5G |
| Wi-Fi | Wi-Fi 7 | Wi-Fi 6E |
| Bluetooth | 5.4 | 5.4 |
| Power Efficiency | Very good, but performance-focused | Better thermal and power efficiency |
| Gaming Performance | Higher performance, better GPU | Good performance, slightly lower than Adreno |
| AI Capabilities | On-device generative AI, LLM | Efficient AI, image enhancement, 10B models |
| Target Market | Premium mid-range / flagship killer | Upper mid-range smartphones |
Snapdragon 8s Gen 3 was officially unveiled by Qualcomm on March 18, 2024, targeting premium mid-range and upper-tier devices with flagship-level features.
Dimensity 8300 Ultra, on the other hand, was launched a few months earlier in November 2023, continuing MediaTek’s momentum in providing high-efficiency, AI-focused chipsets.
Both chipsets are built on TSMC’s efficient 4nm process, ensuring power efficiency and high performance. However, the internal architectures differ significantly:
Snapdragon 8s Gen 3 features:
This configuration offers a flagship-tier experience, especially in CPU-intensive and multitasking scenarios.
Dimensity 8300 Ultra is equipped with:
While it lacks the high-performance Cortex-X series core, its cluster of Cortex-A715s at high frequencies delivers solid upper mid-range performance with better thermal efficiency.
Snapdragon 8s Gen 3 uses the Adreno 735 GPU, which supports high frame rate gaming, advanced HDR graphics, and hardware-accelerated ray tracing (to a limited extent).
Dimensity 8300 Ultra packs a Mali-G615 MC6 GPU, which is competent for everyday gaming but slightly trails in raw graphical horsepower compared to the Adreno series.
Verdict: For mobile gamers, the Snapdragon 8s Gen 3 provides smoother and more visually immersive gaming experiences.
AI processing is now central to smartphone performance, impacting everything from camera enhancements to voice assistance.
Snapdragon 8s Gen 3 brings a next-gen Hexagon NPU, with support for on-device generative AI, including large language models (LLMs) and real-time image processing.
Dimensity 8300 Ultra is no slouch either, boasting the APU 780 with the ability to run AI models up to 10 billion parameters. MediaTek emphasizes energy-efficient AI enhancements, especially for imaging and predictive UI behavior.
Verdict: The Dimensity 8300 Ultra excels in energy-efficient AI processing, but Snapdragon’s LLM and on-device generative AI edge out slightly for power users.
Snapdragon 8s Gen 3 supports:
Dimensity 8300 Ultra offers:
Both chipsets are packed with premium imaging features, but Qualcomm still maintains a slight lead in color accuracy and video stabilization, thanks to better ISP tuning.
Snapdragon 8s Gen 3 is equipped with the Snapdragon X70 5G modem, offering:
Dimensity 8300 Ultra provides:
Verdict: Snapdragon leads here with more advanced wireless tech (Wi-Fi 7 and mmWave 5G), making it more future-proof for high-speed connectivity.
MediaTek is known for efficient chip design, and the Dimensity 8300 Ultra continues this trend. Its slightly lower GPU demands and AI-optimized processes allow for better sustained battery life, especially under mixed workloads.
Snapdragon 8s Gen 3, while powerful, tends to draw more power under heavy gaming or AI workloads, although its efficient 4nm process keeps thermals under control.
The Snapdragon 8s Gen 3 clearly leans closer to the flagship level in terms of performance, connectivity, and gaming. It’s ideal for users seeking a powerful and responsive experience across the board.
Meanwhile, the Dimensity 8300 Ultra stands out as the smart choice for those who value efficient performance, excellent AI features, and overall balanced capabilities at a potentially lower cost.
Both chips are impressive achievements, and your final choice should depend on your specific priorities — whether that’s cutting-edge speed or all-day endurance.
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